Redesigning LED Packaging by Bryant Lee

Redesigning LED Packaging is Bryant Lee's Senior Thesis at the School of Art & Design at the University of Michigan and is a project featured on The Die Line.

Bryant utilized the laser cutter to create different design iterations for the packaging, some of which can be seen in the image below.

Ultimately the final design utilized laser cutting perforation to create a collapsible structure that was used for protective padding and perforation to create a hexagonal prism for the outer packaging container. This project illustrates the importance of revision iterations in the design process.